At Partronik, we specialize in providing high-quality PCB assembly (PCBA) solutions for industries like automotive, medical, robotics, and more. Based in Shenzhen, China, we offer fast prototyping (as quick as 24 hours) and reliable mass production services. With over 2,500 trusted suppliers, we ensure top-quality components and timely delivery, backed by certifications like ISO 9001 and IATF 16949.
PCB manufacturing
Specializing in high-layer PCBs.
Fast and accurate delivery
Special process
High quality
Automotive Board
Layers:8
Board Thickness:4.5mm
Base Material:51000-2M
Minimum Hole Size:0.4mm
Surface Finish:ENIG
Line Width/Spacing:8/9mil
Process Features:Resin plugging, Heavy Resin plugging, Heavy copper
High-Speed Board
Layers:12
Board Thickness:2.0mm
Base Material:Panasonic M6
Minimum Hole Size:0.2mm
Surface Finish:ENIG (Immersion Gold)
Line Width/Spacing:4/4mil
Process Features:Blind Vias (L1-L2/L1-L3/L1-L4/L9-L12/L10-L12/L11-L12)
Double Blind Vias + Plated Half-holes Board
Layers:6
Board Thickness:1.6mm
Base Material:FR-4
Minimum Hole Size:0.2mm
Surface Finish:ENIG
Line Width/Spacing:8/8mil
Process Features:Blind Vias (L1-L3/L4-L6), Heavy Copper (4oz), Plated Half-holes
Special Process Board
Layers:6
Board Thickness:2.4mm
Surface Finish:ENIG
Process Features:Stepped cavities + controlled depth drilling/milling
Industrial Power Supply Board
Layers:12
Board Thickness:3.0mm
Base Material:S1000-2
Minimum Hole Size:0.35mm
Surface Finish:ENIG
Line Width/Spacing:8/10mil
Process Features:Resin plugging, Inner Layer 4oz, Coverlay
Communication High-Speed Backplane
Layers:24
Board Thickness:3.0mm
Base Material:Panasonic M6
Minimum Hole Size:0.25mm
Surface Finish:ENIG
Line Width/Spacing:3.5/4mil
Process Features:12 sets of back drilling, 32 impedance control groups, controlled depth stepping
Communication High-Frequency Board
Layers:6
Board Thickness:2.4mm
Base Material:TU-872 + R4350
Minimum Hole Size:0.3mm
Surface Finish:ENIG
Line Width/Spacing:5.9/6.0mil
Process Features:Mixed materials for high-frequency applications
Military Communication High-Frequency Board
Layers:3
Board Thickness:3.2mm
Base Material:F4BM-1/2
Minimum Hole Size:0.6mm
Surface Finish:ENIG
Line Width/Spacing:12/14mil
Process Features:Mixed material stepped board, metal-clad edge plated half-holes
IC Test Board
Layers:10
Board Thickness:3.0mm
Base Material:S1000-2
Minimum Hole Size:0.2mm
Surface Finish:ENIG 30μ
Line Width/Spacing:6/8mil
Process Features:Stacked blind via structure (L3-8/L8-10/L9-10), via-in-pad
Industrial Control Board
Layers:3
Board Thickness:1.2mm
Base Material:Copper substrate + R4350
Minimum Hole Size:0.5mm
Surface Finish:ENIG
Line Width/Spacing:8/8mil
Process Features:Hybrid lamination of copper substrate and Rogers material
Charging Pile Board
Layers:1
Board Thickness:5.0mm
Base Material:Aluminum substrate + copper block
Minimum Hole Size:0.7mm
Surface Finish:ENIG
Line Width/Spacing:10/8mil
Process Features:Embedded copper block for thermal management
Communication Board
Layers:2
Board Thickness:0.254mm
Base Material:Rogers 5880
Minimum Hole Size:0.15mm
Surface Finish:ENIG
Line Width/Spacing:8/10mil
Process Features:Copper paste filling with line width tolerance ±0.02mm
SMT (Surface Mount Technology)
Assembly: Starting from a single piece, single/double-sided mounting available. Supports customer-supplied/outsourced materials. Self-developed intelligent MES system and production dashboard, implementing strict SPC process control and full digital management to ensure traceability and meet IPC-A-610 quality standards.
24-hour fast prototyping
7x24H consultative full-service support
99.99% production yield
One-stop PCBA Service (High-Quality, Fast and Accurate Delivery)
Digitalized intelligent factory, enabling one-stop high-quality flexible production and delivery from PCB to PCBA. We provide online project management, BOM version control, PCBA testing and sampling, full-cycle feasibility analysis (DFx), and digital supply chain and rolling inventory services.